MoU signed to bring substrate manufacturing technology to India;

Union Minister of Electronics & IT, Ashwini Vaishnaw; along with Chief Minister of Odisha, Mohan Charan Majhi; CEO, Intel, Lip-Bu Tan, and other dignitaries, witnessed the signing of an MoU to bring substrate manufacturing technology to India.

The MoU has been signed between the Government of Odisha, Intel Corporation and 3DGS Inc. USA for a framework to establish an Advanced Packaging Glass Core Substrate Manufacturing Facility in Odisha.

The project, with an estimated investment of approximately USD 3.3 billion, represents one of the largest high-technology manufacturing investments in the country. The facility is proposed to be located in the Bhubaneswar–Khurda region.

Union Minister for Electronics & IT stressed that signing of the landmark MoU is in line with the Government’s vision of developing the entire ecosystem of semiconductor manufacturing in India. He said that the entry of firms like Applied Materials Inc., Lam Research, Tokyo Electron Ltd., Merck Electronics, and signing of the MoU between Tata Electronics and Dutch multinational ASML – is a recognition of the Government’s efforts in the semiconductor sector and the trust the industry places in India.(UPDATED ON 29TH MAY 2026)